Ultrasonic Cleaning Procedure for ASICs and GPUs
⚠️ Important Notes Before You Begin
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This process is intended for non-powered devices only. Ensure all components are disconnected from power and fully discharged.
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Remove all batteries, thermal pads, thermal paste, and plastic fan blades (if not submersible).
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Never clean devices that are actively powered or hot.
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Only use ultrasonic cleaning equipment designed for electronics, such as those made by Omegasonics.
🧰 Materials Needed:
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Omegasonics ultrasonic cleaner (40 kHz with sweep frequency)
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Omegasonics-approved electronics-safe cleaning detergent
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Deionized or distilled rinse water
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Compressed air (oil-free) or drying oven
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Antistatic gloves and work surface
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ESD-safe brushes (optional for heavy debris)
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Drying rack or trays
📝 Step-by-Step Procedure:
1. Pre-Clean Inspection
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Visually inspect ASIC boards or GPU cards.
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Remove loose dirt and debris with an antistatic brush or compressed air.
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Remove fans, thermal pads, or heat sinks (if required for model).
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Document serial numbers and hardware condition (optional for inventory).
2. Prepare the Ultrasonic Cleaning Tank
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Fill ultrasonic tank with deionized water and electronics-safe detergent at recommended dilution.
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Set temperature to between 100°F and 120°F (37–49°C) — do not exceed 130°F to protect solder joints.
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Degas the solution (run ultrasonics without parts for 5–10 minutes).
3. Load the Components
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Place ASIC or GPU boards in a stainless-steel basket. Boards should not touch each other.
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Ensure boards are upright or slightly angled to prevent air pockets.
4. Cleaning Cycle
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Lower the basket into the cleaning tank.
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Set the ultrasonic timer for 2–5 minutes depending on contamination level.
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Observe the process. If heavy bubbling occurs around a specific area, shorten the cycle slightly.
5. Rinse
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Remove boards from ultrasonic cleaner and immediately transfer them into a separate rinse tank filled with deionized water.
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Agitate manually or with a gentle spray to remove detergent residues.
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Optional: Run a quick ultrasonic rinse cycle with pure water for best results.
6. Drying
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Use compressed air (oil-free, dry) to remove water from components and connectors.
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Place boards in a drying chamber or drying room 120°F-130°F at not more than 130°F (54°C) for at least 6-8 hours.
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Ensure components are completely dry before reassembling or powering on.
7. Final Inspection
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Visually inspect solder joints, connectors, and thermal paste areas.
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Reapply thermal paste and reinstall heat sinks and fans if removed.
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Reassemble and re-test using standard diagnostics or hashing software.
✅ Tips for Success
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Clean similar components in batches for consistent timing.
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Use dedicated tanks for rinse vs detergent to avoid cross-contamination.
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Schedule routine ultrasonic cleanings every 2–3 months depending on environment.
🚫 What Not to Do
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Do not use flammable solvents or IPA inside the ultrasonic tank.
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Do not exceed recommended temperature or exposure times.
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Do not submerge batteries or components with active capacitors.
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Do not power the unit before it’s fully dried and reassembled.